ESD IXPE Foam for Semiconductor Protection 2025-07-02

Clean. Resilient. Static-Safe. Designed for Precision.
— From Yufa Polymer Products Co., Ltd.


In semiconductor packaging and handling, even microscopic damage or a static discharge can compromise critical components. Yufa’s black ESD IXPE foam is engineered to offer the ideal balance of softness, structural support, and static control — especially in applications requiring medium-thickness cushioning (3–6 mm).


��️ Key Features

✅ Reliable ESD Protection

· Surface resistance: 10–10 Ω

· Stable, permanent anti-static performance under varying humidity

✅ Cleanroom-Compatible Material

· Closed-cell, crosslinked PE foam

· Dust-free, low VOC, no crumbling — safe for wafer-level use

✅ Cushioning + Support in One Layer

· Density: 40–50 kg/m³

· Offers gentle yet stable support for fragile or lightweight devices

· Ideal for medium-thickness applications (3–6 mm)

✅ Custom Processing Friendly

· Die-cut, CNC-routed, adhesive-backed or laminated

· Compatible with trays, covers, ESD boxes, clamshells

✅ RoHS / REACH Compliant

· Eco-friendly and halogen-free options available


�� Applications in Semiconductor Industry

· Wafer & IC shipping trays

· Optical or MEMS module cushioning

· ESD-safe tray liners & foam spacers

· Cleanroom packaging of probes, dies, sensors

· Interlayers for automated packaging lines


�� Standard Product Range

Parameter

Value

Thickness

3–6 mm (customizable)

Density

40–50 kg/m³

Color

Black (standard)

Format

Sheets, rolls, pre-cut pads


�� Need Custom Cut ESD Foam? Let’s Talk.
Email: info@yufapolymer.com
Web: www.yufapolymer.com
Factory Address: E-301 Yongfa Park, Shajing, Baoan District, Shenzhen, China


�� Built for cleanrooms. Trusted in semiconductor lines. Delivered by Yufa.






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