Clean. Resilient. Static-Safe. Designed for Precision.
— From Yufa Polymer Products Co., Ltd.
In semiconductor packaging and handling, even microscopic damage or a static discharge can compromise critical components. Yufa’s black ESD IXPE foam is engineered to offer the ideal balance of softness, structural support, and static control — especially in applications requiring medium-thickness cushioning (3–6 mm).
��️ Key Features
✅ Reliable ESD Protection
· Surface resistance: 10⁶–10⁹ Ω
· Stable, permanent anti-static performance under varying humidity
✅ Cleanroom-Compatible Material
· Closed-cell, crosslinked PE foam
· Dust-free, low VOC, no crumbling — safe for wafer-level use
✅ Cushioning + Support in One Layer
· Density: 40–50 kg/m³
· Offers gentle yet stable support for fragile or lightweight devices
· Ideal for medium-thickness applications (3–6 mm)
✅ Custom Processing Friendly
· Die-cut, CNC-routed, adhesive-backed or laminated
· Compatible with trays, covers, ESD boxes, clamshells
✅ RoHS / REACH Compliant
· Eco-friendly and halogen-free options available
�� Applications in Semiconductor Industry
· Wafer & IC shipping trays
· Optical or MEMS module cushioning
· ESD-safe tray liners & foam spacers
· Cleanroom packaging of probes, dies, sensors
· Interlayers for automated packaging lines
�� Standard Product Range
Parameter |
Value |
Thickness |
3–6 mm (customizable) |
Density |
40–50 kg/m³ |
Color |
Black (standard) |
Format |
Sheets, rolls, pre-cut pads |
�� Need Custom Cut ESD Foam? Let’s Talk.
Email: info@yufapolymer.com
Web: www.yufapolymer.com
Factory Address: E-301 Yongfa Park, Shajing, Baoan District, Shenzhen, China
�� Built for cleanrooms. Trusted in semiconductor lines. Delivered by Yufa.