Characteristics of ESD sponge:

Soft, breathable and good resilience;

Therefore, it is very suitable for multiple requirements of product packaging, such as cushioning, shock resistance, impact resistance, high bending...

Application of ESD sponge: 

There are many cases used for packaging, and based on actual applications, they can be summarized as follows.

Ⅰ.Fine and sensitive electronic components that require continuous ESD maintenance in the environment, such as MOSFETs;

II. Product components that require cleanliness and precision, such as hard disk heads;

III. Electronic plugins that require ESD and shockproof properties, such as IC/PCB/PCBA.

Product form of ESD sponge:

Ⅰ.The prototype of product is in block or customized shape;

Ⅱ.Customized processing and shaping according to user needs：

TDS of ESD sponge：

Ⅰ.Density: 16-25Kg/m³

Ⅱ.Color: Pink and Black

Ⅲ.Resistivity: 10^8_10^11Ω