ESD Packaging Solutions for Semiconductors & Optical Modules Precision. Protection. Performance.

ESD Packaging Solutions for Semiconductors & Optical Modules Precision. Protection. Performance. 2025-08-06

✍️ In semiconductor logistics, even a microvolt of electrostatic discharge can damage delicate lCs, TDMA cards, or optical transceivers. That's why we deliver advanced anti-static packaging systems tailored to today's high-speed Al chips and optical communication modules..

�� Applications We Serve:

● Al processors, TDMA network cards, high-speed optical modules

● Wafer-level chip packaging and sensitive component storage

● Cross-border shipment of lC components requiring ESD Class 0 compliance

⚙️ Product Highlights:

● Conductive trays and lC carriers (JEDEC standard or OEM)

● Anti-static PE/EVA foam inserts with precision die-cutting

● Black corrugated plastic boxes with matching ESD knife-type dividers.

�� Your Benefits:

● Prevents damage from triboelectric buildup during handling or transport

● Supports cleanroom-compatible packaging

● Stackable and reusable options to optimize warehouse workflows

�� Get your quote: info@yufapolymer.com
��Visit us:: www.yufapolymer.com

�� Address: 3rd Floor, Building E, North Yongfa Shangliao Park, Baoan District, Shenzhen, Guangdong, P.R. China.

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