ESD (Electrostatic Dissipative) Acrylic Sheet

Technical Data Sheet

Document No.: TDS-ESD-PMMA-001        Revision: Rev 1.0        Release Date: 2025-06-23

■  Product Overview

The ESD Acrylic Sheet is based on polymethyl methacrylate (PMMA) substrate, coated with a transparent conductive layer (cross-linked polymer coating) on the surface. While retaining the excellent optical properties and mechanical strength of PMMA, the coating provides the sheet with permanent and stable electrostatic dissipative functionality. The coating is of permanent design; ESD performance is unaffected by ambient humidity and requires no periodic re-coating.

The product is widely used in cleanroom construction and electrostatic protection in industries including semiconductor, LCD/OLED, electronic equipment, precision instruments, pharmaceutical, and bioengineering.

 Key Features

• Permanent Electrostatic Dissipation: Surface resistance 10⁶~10⁸ Ω/sq; ESD performance unaffected by humidity, temperature, or time

• Rapid Static Decay: Static decay time < 0.05 seconds (standard limit 2 seconds), far exceeding industry requirements

• Triboelectric Resistance: No charge accumulation from contact-separation processes when properly grounded

• High Light Transmittance: Transparent type light transmittance ≥90%, minimal optical distortion, meeting precision observation needs

• Superior Surface Hardness: Cross-linked polymer coating with significantly better scratch and abrasion resistance than standard PMMA

• Uniform Surface Treatment: No conductive discontinuities (“hot spots”), preventing localized static accumulation

• Lightweight & High Strength: Density ~1.19 g/cm³, approximately half the weight of same-thickness glass; impact resistance 15 times that of same-thickness tempered glass

• Flame Rating: UL-94 HB, meeting general industrial fire protection requirements

■  Technical Parameters

■  Available Specifications

4.1 Standard Sizes & Thicknesses

4.2 Thickness Selection Guide

4.3 Available Colors

■  Application Areas

5.1 Semiconductor & Microelectronics Manufacturing (Core Market)

• Cleanroom windows & doors: Prevents electrostatic adsorption of particulate contamination on wafers

• Equipment covers / observation windows: External isolation for lithography, etching, deposition processes

• Chip trays / carriers: Prevents ESD-induced immediate or latent damage to chip circuits

• Mini-environment panels: ESD protection for wafer transfer channels

5.2 LCD / OLED Display Manufacturing

• LCD production line partitions and observation windows

• Dust-proof covers for backlight module assembly areas

• Fixtures and protective covers for panel inspection stations

5.3 Electronics Assembly & SMT

• SMT production line fixtures and test jigs (ICT / FCT)

• Conveyor line protective covers and equipment windows

• Explosion-proof shields (prevents ESD spark ignition)

5.4 Pharmaceutical, Biotech & Precision Optics

• GMP cleanroom partitions, biosafety cabinet observation windows

• Dust-proof covers for pharmaceutical packaging areas (anti-static, dust-repellent, easy to clean)

• Optical instrument assembly area protective covers, laser equipment protective windows (yellow UV-filtering type)

■  Fabrication Guide

■  Standards & Certification Reference

• ANSI/ESD S20.20: ESD control program standard

• IEC 61340-5-1: International standard for ESD protection of electronic devices

• ANSI/ESD S4.1: Standard for surface resistance testing of electrostatic dissipative materials

• Federal Test Standard 101C, Method 4046-1: Static decay testing

• UL-94 HB: Flame rating certification

• ASTM D1003: Light transmittance testing standard

■  Storage & Handling Precautions

• Storage Environment: Store in a dry environment at room temperature; avoid high temperature (>80°C), high humidity, and direct sunlight

• Surface Protection: Double-sided protective film applied; remove only after installation is complete to avoid coating scratches

• Cleaning Method: Use a soft, lint-free cloth for wiping; do not use organic solvents such as acetone or toluene

• Grounding Requirements: Sheets must be effectively grounded through a conductive frame or conductive path to ensure ESD dissipative function

• Bonding Process: Bonding surfaces must be mechanically abraded to remove the coating; otherwise bond strength cannot be guaranteed

• Cutting Notes: Keep the protective film on during processing; remove only after completion to reduce the risk of surface scratches

■  Material Comparison