Yufa Polymer manufactures high-end ESD JEDEC trays for semiconductor and electronic component handling, baking, storage, and transportation. Our trays are designed for applications requiring high temperature resistance, high dimensional accuracy, stable ESD performance, and reliable stacking.
Made from virgin MPPE + GF material, our JEDEC trays provide excellent heat resistance, low water absorption, and stable mechanical strength. They are suitable for IC, QFN, BGA, SOP, modules, and other sensitive electronic components.
We support custom JEDEC tray development based on 3D drawings, samples, Gerber files, or chip/component dimensions.
Key Features
•High-temperature ESD JEDEC trays for semiconductor packaging
•Virgin MPPE + GF material, no recycled material
•Surface resistance: 1×10⁴ ~ 1×10⁹ Ω
•Suitable for MSL3 baking conditions
•Dimensional stability after high-temperature baking
•High precision pocket design for secure component positioning
•Stable stacking, no wobbling under load
•Custom pocket layout, markings, tray structure, and size available
•RoHS, ESD, heat resistance, and dimensional reports available upon request
•Sample development normally available in 10–15 working days after confirmation
Custom JEDEC Tray Solutions
Yufa Polymer can produce different types of JEDEC trays according to customer requirements. Whether you need standard JEDEC tray dimensions or a fully customized tray for special components, our engineering team can support design review, mold development, material selection, injection molding, and quality inspection.
Applications
•Semiconductor component packaging
•IC, QFN, BGA, SOP, and module trays
•Moisture-sensitive component baking
•SMT and electronics assembly process
•ESD-safe storage and transportation
•Automated handling and production line use
